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MICROIP Stuns at Embedded World 2026! Platform Operates Seamlessly Across Major AI Ecosystems, Securing Multinational Business Opportunities via Software-Hardware Integration

News Release
2026-03-23

MICROIP (Stock Code: 7796) reported triumphant results at the world's largest embedded electronics and industrial computer application exhibition (Embedded World 2026). The company demonstrated that its platform operates seamlessly across major AI platforms from industry leaders like MediaTek and NVIDIA in the AIoT domain. Furthermore, MICROIP shined at the event with its "AI × ASIC" software and hardware integration capabilities, attracting nearly 2.5 times more visitors than in previous years. Leveraging its deep layout in Edge AI software platforms and custom ASICs, MICROIP has initiated substantial project alignments with multiple multinational enterprises, which is expected to inject strong growth momentum into its mid-to-long-term operations.

Dr. James Yang, Chairman of MICROIP, stated that the dual-engine strategy combining AI software platforms and ASIC design will accelerate clients' transition from Proof of Concept (POC) to scaled deployment, consolidating the company's global edge computing layout.

Dr. James Yang, Chairman of MICROIP, stated, "The enthusiastic feedback at Embedded World 2026 validates the strategic height of our deep cultivation in vertical software and hardware integration. Through our AI software service platform, MICROIP helps clients bridge the gap from Proof of Concept (POC) to scaled deployment; coupled with our ASIC design services that precisely meet the demand for high performance and low power consumption, this dual-track momentum will be the key cornerstone for MICROIP to continuously stand firm in the global edge computing market."

Seizing Key Positions in Edge AI Deployment: Operating Seamlessly Across International AI Ecosystems
As AI computing demand extends from data centers to terminal devices, Edge AI has become a crucial driver for global industrial upgrades. At Embedded World 2026, it was highlighted that MICROIP's platform operates seamlessly across the Edge AI ecosystems of major chip giants like MediaTek and NVIDIA. This signifies that MICROIP's technical capabilities and solutions have been highly recognized. Through its seamless cross-platform operation, MICROIP can accelerate the practical implementation of AI technology in smart manufacturing, security monitoring, drones, and various other fields, upgrading from a "technology provider" to an "application deployment promoter".



MICROIP showcased its software and hardware integration capabilities at Embedded World 2026, partnering with international tech giants to expand its collaborative footprint and accelerate the deployment of global projects.

AIVO Advances into Autonomous Drone Applications, Expanding New AI Commercialization Momentum in Diverse Scenarios

The AIVO AI vision software platform demonstrates highly accurate recognition capabilities in the security domain, effectively distinguishing violent altercations from normal behaviors to avoid false alarms, while also supporting diverse detections such as fire, smoke, and weapons. The application further extends to drones. Through visual AI empowerment, drones are upgraded from traditional manual remote control to an AI system with autonomous task execution capabilities. Even under signal-jammed scenarios, they can maintain operations without ground station instructions, significantly reducing reliance on professional pilots. During the Embedded World 2026 exhibition, this attracted cooperation discussions from clients across diverse fields, including smart cities, fire security, industrial safety inspection, 3D topographical mapping, and wide-area livestock management. Simultaneously, MICROIP is also following a "software-driven hardware" strategy, deepening the collaborative integration of drone software and hardware to actively lay the groundwork for the next-generation high-end autonomous vehicle market.

 

XEdgAI Connects International Partners to Build Cross-Platform Edge AI Integration Capabilities

To break through underlying heterogeneous computing barriers, MICROIP utilized the XEdgAI Edge AI deployment platform to join hands with Axiomtek, Lex, and European AI chip manufacturer Axelera AI to jointly display technology integration results. Through standardized tools and systematic deployment architectures, it effectively assists system integrators in lowering the development threshold for high-performance AI applications, accelerating the deployment process, and gradually building a transnational Edge AI ecosystem centered on Taiwan.

 

High-End NPU ASIC Project Initiated, Directly Targeting the High-Privacy Edge AI Application Market

Regarding Custom ASIC Technology & Solutions (CATS), MICROIP has received client inquiries and is currently actively aligning with the development needs of an Edge AI ASIC SoC integrating a 60 TOPS high-computing, low-power NPU. This architecture is expected to enable terminal devices to efficiently execute Large Language Model (LLM) reasoning locally without relying on the cloud, precisely solving data protection needs in high-privacy and high-security scenarios. As the project progresses smoothly in the future, both parties look forward to taping out at a top international wafer foundry. Furthermore, relying on Multi-Die Integration technology, MICROIP has shortened the chip mass production schedule to just 6 months. This breakthrough performance stood out at the exhibition, winning high favor and technical affirmation from major European industrial and automotive manufacturers.

 

Arculus EDA Tools Enhance Design Efficiency, Accurately Addressing Key Bottlenecks in Chip Manufacturing Processes

Faced with the rising complexity of chip design, the EDA tools (ETAL and iPROfiler) developed by Arculus EDA UK under the group also became a focus of attention at the exhibition. Through AI-driven automated connection checking and performance analysis mechanisms, they can reduce manual development burdens by about 80% and accurately identify performance bottlenecks 6 to 9 months earlier. This assists ASIC design companies in effectively improving development efficiency and product competitiveness even under process and capacity pressures.


Taiwan's Representative to Germany, Ambassador Gu Ruisheng, visited the MICROIP booth to discuss the international layout of the AI industry chain, strengthening the company's momentum for global expansion.

Connecting the "Team Taiwan" AI Ecosystem: Taiwan's Representative to Germany Visits to Strengthen International Layout Momentum

MICROIP is actively establishing an AI industry ecosystem centered on Taiwan, promoting the integration of technology and industry resources. During the Embedded World 2026 exhibition, Taiwan's Representative to Germany, Ambassador Gu Ruisheng, specially visited the booth in person. Both sides had in-depth exchanges on the international layout and technological integration advantages of Taiwan's AI industry chain, strengthening MICROIP's connection and momentum in expanding into international markets and adding further assistance to its global expansion plan.