The three-day Taipei AI EXPO concluded successfully, underscoring a clear industry shift from AI technology demonstrations to real-world deployment. MICROIP (stock code: 7796) emerged as one of the highlights of this year’s exhibition, showcasing its integrated capabilities across AI software and ASIC design services.

During the exhibition, MICROIP’s booth attracted strong attention from industry professionals. Dozens of companies from Taiwan and international markets entered substantive discussions for potential collaborations, reflecting robust demand for deployable, real-world AI solutions.

Building on this momentum, MICROIP further demonstrated its system-level integration strategy spanning from foundational silicon to edge devices. Supported by proven in-house chip development achievements, the company has firmly established its strategic positioning as a full-stack AI solutions provider.

 
MICROIP showcased three core technologies at AI EXPO—AIVO, XEdgAI, and its AI in-vehicle system—each achieving key breakthroughs in real-world deployment and commercial engagement.

Chairman Dr. James Yang: Completing the Critical Technology Puzzle to Unlock Long-Term Industry Value

Dr. James Yang, Chairman of MICROIP, stated:
“The feedback from this exhibition highlights rapidly accelerating demand for real-world AI deployment. As the growth of Edge AI continues to drive demand for highly integrated chips, MICROIP has already secured the critical pieces of the technology puzzle through the strong R&D capabilities of our in-house team.

This not only strengthens our customized ASIC service capabilities, but also expands our competitive advantage in software-driven hardware integration. MICROIP is committed to enabling enterprises to integrate AI into real operational environments, transforming it into stable and efficient productivity tools. This lays a solid foundation for our long-term growth. Our one-stop integration capabilities are also a key factor attracting leading domestic and international companies to pursue deeper collaboration with us.”

Proven NFC Chip Yield Above 99% Underscores Deep Analog and RF Design Expertise

As Edge AI applications impose increasingly stringent requirements on latency and power efficiency at the device level, single-function chips are no longer sufficient to support complex use cases.

MICROIP has previously achieved a key milestone with the successful in-house development of its NFC chip, delivering a yield rate exceeding 99%. This achievement validates the company’s strong capabilities in radio frequency (RF) and analog design.

The design team brings extensive experience across wireless communications, power management, and high-speed interface technologies, and has played a key role in chip development projects for leading global clients in 5G, Wi-Fi, and IoT applications.

Through seamless collaboration between its digital IC and system architecture teams, MICROIP has established a one-stop ASIC design services platform integrating digital, analog, and RF capabilities. This comprehensive approach not only accelerates customers’ product development and time-to-market, but also strengthens MICROIP’s competitive positioning in the global Edge AI and customized ASIC markets—solidifying its role as a trusted AI solutions provider.

CTO Dr. Liang Wu emphasized that AI competition is shifting toward system-level integration. MICROIP’s AIVO AI vision platform enables deployable and maintainable edge AI systems, enhancing stable operation under high-load conditions.

CTO Dr. Liang Wu: AI Competition Shifts to System-Level Integration; AIVO Enables Scalable and Deployable Architectures

From a software and systems perspective, CTO Dr. Liang Wu further noted:
“The global AI landscape is transitioning from a model-centric paradigm to a system-centric one. The real challenges lie in model compression, edge deployment, and environmental robustness. AI must evolve into a core system that enterprises can reliably operate at scale.”

MICROIP’s proprietary AIVO platform is built on a containerized, microservices-based architecture that supports dynamic resource orchestration. It also integrates real-time monitoring and automated fault recovery mechanisms, significantly enhancing system stability under high workloads and complex operating conditions, ensuring long-term reliable deployment of AI applications at the edge.

Three Core Technologies Demonstrate Strong Capabilities, Driving Both Order Momentum and Market Attention

Aligned with its full-stack AI strategy, MICROIP showcased three core technologies at AI EXPO, each achieving notable progress in real-world deployment and commercial engagement:

• AIVO Platform Gains Strong Recognition Across Industry, Government, Academia, and Investment Communities
  AIVO has successfully enabled edge AI deployments across drones, smart security, smart manufacturing, and smart agriculture. Its high-efficiency inference architecture significantly reduces power consumption and latency at endpoint devices. During the exhibition, the platform attracted substantial inbound inquiries with strong commercial intent. Its clearly defined deployment model also drew significant attention from government agencies, research institutions, and investment organizations.

• XEdgAI Addresses Cross-Platform Deployment Challenges in Edge Environments
  To overcome deployment challenges across heterogeneous hardware environments, XEdgAI leverages advanced cross-platform optimization technologies to seamlessly deploy AI models across mainstream AIoT platforms, including NVIDIA, while enabling efficient model conversion and optimization across NPU, GPU, and CPU architectures. MICROIP has partnered with ecosystem leaders including Axiomtek, LEX SYSTEM, and AI chip company Axelera AI to ensure optimal hardware-software performance. Strong interest from device manufacturers seeking rapid cross-platform deployment solutions highlights growing market demand in this segment.

• AI In-Vehicle and Autonomous Systems Attract Leading Global Industry Players
  MICROIP’s newly introduced AI in-vehicle and autonomous system integrates sensor fusion with real-time edge inference capabilities. By processing high-resolution data directly on-device, the system achieves millisecond-level latency while addressing thermal challenges in demanding environments. The showcase attracted strong interest from leading domestic and international companies, leading to active discussions on customized development and system integration. This segment is expected to become a key driver of future revenue growth.